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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

One component, low stress adhesive.
Unit of Measure

Max. Volume Resistivity

N/A 5 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 120000 cps

Cure

N/A 2 h at 110 ºC

Secondary Cure Option

N/A 15 min at 175 ºC

Lap Shear Strength

N/A 434 psi

Conductivity

N/A 4 W/m·K

Tg

N/A 24 ºC

CTE Below Tg

N/A 55 ppm/ºC
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