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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

High temperature resistant, high strength, excellent adhesion to gold.
Unit of Measure

Max. Volume Resistivity

N/A 2 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A Yes

Viscosity

N/A 19000 cps

Work Life at Room Temperature

N/A 7 days

Cure

N/A 1 h at 175 ºC

Secondary Cure Option

N/A 2 h at 160 ºC

Die Shear Strength

N/A 5100 psi

Conductivity

N/A 2.1 W/m·K

Tg

N/A 160 ºC

CTE Below Tg

N/A 45 ppm/ºC

CTE Above Tg

N/A 120 ppm/ºC
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