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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

High thermally conductive chip attach adhesive.
Unit of Measure

Max. Volume Resistivity

N/A 0.0001 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 12000 cps

Work Life at Room Temperature

N/A 8 h

Cure

N/A 4 min at 130 ºC

Die Shear Strength

N/A 6300 psi

Conductivity

N/A 3 W/m·K
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