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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Stress absorbing adhesive designed for solder replacement
Unit of Measure

Max. Volume Resistivity

N/A 5 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A Yes

Viscosity

N/A 55000 cps

Work Life at Room Temperature

N/A 2 weeks

Cure

N/A 1 h at 130 ºC

Secondary Cure Option

N/A 30 min at 150 ºC

Lap Shear Strength

N/A 1650 psi

Die Shear Strength

N/A 6200 psi

Conductivity

N/A 3.2 W/m·K

Tg

N/A 90 ºC

CTE Below Tg

N/A 55 ppm/ºC

CTE Above Tg

N/A 200 ppm/ºC
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