Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Copper filled RTV Silicone for RF shielding applications
Unit of Measure

Max. Volume Resistivity

N/A 0.03 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Work Life at Room Temperature

N/A 8 h

Cure

N/A 1–4 days at 25 ºC

Lap Shear Strength

N/A 125 psi

Tg

N/A –33 ºC