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General purpose, light paste, fast heat/RT cure, 30 min. pot life, 0.025–0.127 mm bond lines, available in easy mix packs & syringes.
Unit of Measure

Filler

N/A Ag

Resin Type (Parts)

N/A epoxy (2)

Specific Gravity

N/A 2.5 g/cc

Max. Volume Resistivity

N/A 0.002 O/cm

Lap Shear Min.

N/A 1200 psi8274 kPa

Elevated Temperature Cure Cycle Time

N/A 0.25 h at 235 °F (113 ºC)

RT Cure Time

N/A 24 h

Working Life

N/A 30 min

Shelf Life at RT (Mos.)

N/A 9

Application

N/A Bonding enclosures, connector shielding
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