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General purpose, very thick paste, fast heat/RT cure, < 0.254 mm bond lines.
Unit of Measure

Filler

N/A Ag/Cu

Resin Type (Parts)

N/A epoxy (2)

Specific Gravity

N/A 5.0 g/cc

Max. Volume Resistivity

N/A 0.005 O/cm

Lap Shear Min.

N/A 1600 psi11032 kPa

Elevated Temperature Cure Cycle Time

N/A 2 h at 150 °F (66 ºC)

RT Cure Time

N/A 24 h

Working Life

N/A 1 h

Shelf Life at RT (Mos.)

N/A 9

Application

N/A EMI gasket attachment, bonding enclosures
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