Epoxy Encapsulant Product
Electronics Potting & Encapsulation
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is the other critical component for product durability and reliability. Under the leading Hysol® and Stycast™ brands, Henkel offers several PCB protection products to minimize external product stress and maximize performance. Our portfolio of conformal coatings keeps moisture, humidity and other adverse conditions from deteriorating printed circuit boards used in harsh marine, automotive, aerospace and consumer electronics applications. Henkel also strives to keep environmental consciousness at the forefront of all our product development efforts, which is why we have moved toward solvent-free, low-VOC materials and processes.
Henkel’s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, offering electrical insulation, and protecting against vibration and shock.
Henkel’s potting and encapsulation compounds protect PCBs and electrical devices by enhancing mechanical strength, offering electrical insulation, and protecting against vibration and shock.
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Item # |
Type |
Catalyst |
Viscosity at 25 ºC |
Mix Ratio (wt) |
Specific Gravity |
Hardness |
---|---|---|---|---|---|---|
1495K/Catalyst 9 | Type N/A Thermally Conductive | Catalyst N/A 9 | Viscosity at 25 ºC N/A 10000 cps | Mix Ratio (wt) N/A 100:4.5 | Specific Gravity N/A 1.89 g/cc | Hardness N/A 95 D |
1495K/Catalyst 23LV | Type N/A Thermally Conductive | Catalyst N/A 23LV | Viscosity at 25 ºC N/A 10000 cps | Mix Ratio (wt) N/A 100:9 | Specific Gravity N/A 1.82 g/cc | Hardness N/A 90 D |
1495K/Catalyst 11 | Type N/A Thermally Conductive | Catalyst N/A 11 | Viscosity at 25 ºC N/A 14000 cps | Mix Ratio (wt) N/A 100:5 | Specific Gravity N/A 1.89 g/cc | Hardness N/A 95 D |
1266 | Type N/A Low Viscosity | Catalyst N/A Part B | Viscosity at 25 ºC N/A 650 cps | Mix Ratio (wt) N/A 100:28 | Specific Gravity N/A 1.15 g/cc | Hardness N/A 75 D |
1265 | Type N/A Low Viscosity | Catalyst N/A Part B | Viscosity at 25 ºC N/A 600 cps | Mix Ratio (wt) N/A 100:100 | Specific Gravity N/A 1.08 g/cc | Hardness N/A 25 A |
1090/Catalyst 23LV | Type N/A Low Viscosity | Catalyst N/A 23LV | Viscosity at 25 ºC N/A 5000 cps | Mix Ratio (wt) N/A 100:18.5 | Specific Gravity N/A 0.81 g/cc | Hardness N/A 75 D |
1090/Catalyst 11 | Type N/A Low Viscosity | Catalyst N/A 11 | Viscosity at 25 ºC N/A 29000 cps | Mix Ratio (wt) N/A 100:10.5 | Specific Gravity N/A 0.80 g/cc | Hardness N/A 82 D |
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