Because heat output is equivalent to the amount of power that goes into an electronics system, some type of damage is inevitable as temperatures rise; thermal interface materials are critical for ensuring system reliability and preventing damage caused by excess heat.
Thermal management should therefore be a top priority during the design of any type of electronics system.
Thermal Management Products
In addition to maintaining reliability and safety, thermal management is also critical for ensuring the longevity of electronics systems. When components within a system continually operate at high temperatures or are exposed to excessive temperatures for extended periods of time, their functionality and operational life will inevitably be compromised; the longer components operate under these conditions, the sooner they will degrade and ultimately fail. This, of course, leads to the need for time-consuming and costly maintenance, if not the complete replacement of the system. And depending on the specific industry and application, system failure can be extremely dangerous, posing great risks to workers. But these issues can be easily avoided with proper design and implementation of high-quality thermal interface solutions.
Thermal Interface Pads from Robert McKeown Co.
At Robert McKeown Company, Inc. (RMC), we offer several lines of Parker Chomerics thermal products, including CHO-THERM® and THERMFLOW®.
CHO-THERM® Commercial Grade Thermal Insulator Pads are specially designed for use in applications requiring cost-effective solid thermal and electrical properties. If needed, these pads can also come with an additional adhesive layer for attachment; extra-layer CHO-THERM® materials are available die-cut on continuous rolls. Polyimide- or fiberglass-reinforced versions are also available to protect the pads from external stresses that can result in tears, cuts, and punctures. For applications that require the highest thermal, dielectric, and mechanical properties, CHO-THERM® High Power Insulator Pads are also offered.
THERMFLOW® phase change thermal interface materials, on the other hand, fill interfacial air gaps and voids entirely. These materials are designed specifically to maximize heat dissipation and component reliability. THERMFLOW® materials are solid, easy to handle, ensure consistent and clean application, and are easily conforming. Extremely versatile, they can be applied as dry pads to a heat sink or component surface, and their ability to completely fill air gaps essentially guarantees superior performance over any other thermal interface material. More detailed specifics on Parker Chomerics THERMFLOW® phase change thermal interface materials are available on their site.
A Leading Provider of Thermal Management Products
Robert McKeown has been an industry-leading distributor of engineered electronics materials for over eight decades, and we’re proud to offer our clients high-quality thermal management solutions from Parker Chomerics.
For more information on our thermal management products — and thermal interface and phase change thermal interface materials in particular — reach out to our team today to discuss your project with an expert.