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Specialty Materials for Electronic Assembly
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Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
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Item #
Filler
Resin Type (Parts)
Specific Gravity
Max. Volume Resistivity
Lap Shear Min.
Viscosity
CT 5047-2-A/B
N/A
N/A
N/A
0.02
O/cm
N/A
200000
cps
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