General purpose, light paste, fast heat/RT cure, 30 min. pot life, 0.025–0.127 mm bond lines, available in easy mix packs & syringes.
Unit of Measure

Filler

Ag

Resin Type (Parts)

epoxy (2)

Specific Gravity

2.5 g/cc

Max. Volume Resistivity

0.002 O/cm

Lap Shear Min.

1200 psi8274 kPa

Elevated Temperature Cure Cycle Time

0.25 h at 235 °F (113 ºC)

RT Cure Time

24 h

Working Life

30 min

Shelf Life at RT (Mos.)

9

Application

Bonding enclosures, connector shielding