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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Microelectronic grade, fast cure adhesive.
Unit of Measure

Specifications

Max. Volume Resistivity

N/A 0.001 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 21000 cps

Cure

N/A 1 h at 150 ºC

Secondary Cure Option

N/A 20 s at 275 ºC

Die Shear Strength

N/A 3644 psi

Tg

N/A 116 ºC