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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Flexible, low viscosity.
Unit of Measure

Specifications

Max. Volume Resistivity

N/A 2 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

N/A No

Viscosity

N/A 9000 cps

Work Life at Room Temperature

N/A 8 h

Cure

N/A 2 h at 125 ºC

Secondary Cure Option

N/A 4 h at 100 ºC

Lap Shear Strength

N/A 750 psi

Die Shear Strength

N/A 1790 psi

Conductivity

N/A 1.1 W/m·K

Tg

N/A 66 ºC

CTE Below Tg

N/A 73 ppm/ºC

CTE Above Tg

N/A 390 ppm/ºC