Items |
2651/Catalyst 9 Epoxy Encapsulant Product |
2651/Catalyst 11 Epoxy Encapsulant Product |
2651/Catalyst 23LV Epoxy Encapsulant Product |
2651-1 Epoxy Encapsulant Product |
2741 LV/Viscosity 30000 Epoxy Encapsulant Product |
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Type | N/A General Purpose | |||||||||
Catalyst | N/A 9 | N/A 11 | N/A 23LV | N/A | N/A 15LV | |||||
Viscosity at 25 ºC | N/A 32000 cps | N/A 25000 cps | N/A 3200 cps | N/A 52000 cps | N/A 30000 cps | |||||
Mix Ratio (wt) | N/A 100:7 | N/A 100:8.5 | N/A 100:15 | N/A | N/A 100:25 | |||||
Cure Schedule | N/A Room | N/A Heat | N/A Room | N/A Heat | N/A Room | |||||
Specific Gravity | N/A 1.56 g/cc | N/A 1.56 g/cc | N/A 1.50 g/cc | N/A 1.6 g/cc | N/A 1.43 g/cc | |||||
Hardness | N/A 88 D | N/A 88 D | N/A 86 D | N/A 88 D | N/A 82 D | |||||
Tensile Strength | N/A 6500 psi | N/A 9000 psi | N/A 6500 psi | N/A 8000 psi | N/A 6900 psi | |||||
CTE | N/A 43.3 ppm/ºC | N/A 40 ppm/ºC | N/A 54.7 ppm/ºC | N/A 45 ppm/ºC | N/A 55 ppm/ºC | |||||
Thermal Conductivity | N/A 0.66 W/m·K | N/A 0.66 W/m·K | N/A | N/A 0.58 W/m·K | N/A | |||||
Service Temperature | N/A –40 to 130 ºC | N/A –55 to 155 ºC | N/A –65 to 105 ºC | N/A –40 to 155 ºC | N/A –40 to 90 ºC | |||||
Dielectric Strength | N/A 450 V/mil | N/A 450 V/mil | N/A 450 V/mil | N/A 440 V/mil | N/A 400 V/mil | |||||
Dielectric Constant at 1 MHz | N/A 3.9 | N/A 3.9 | N/A 4.1 | N/A 3.7 | N/A 3.27 | |||||
Volume Resistivity at 25 ºC | N/A 5 x 1015 O/cm | N/A 5 x 1016 O/cm | N/A 5 x 1014 O/cm | N/A 1 x 1015 O/cm | N/A 1 x 1015 O/cm | |||||
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