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One-part moisture cure
Unit of Measure

Specifications

Type

 N/A Thermally Conductive Adhesives

Product Form

 N/A One-Part

Color

 N/A Gray

Viscosity

 N/A 200000 mPa/s

Durometer

 N/A 69 A

Tensile Strength

 N/A 754 psi5.2 MPa53 kgf/cm²

Elongation

 N/A 120 %

Specific Gravity

 N/A 2.17

Linear CTE

 N/A 203 µ/mC
Working Time at Room Temperature1 N/A < 10 min
Room Temperature Cure Time2 N/A 144 h

Unprimed Adhesion Lap Shear

 N/A 230 psi160 N/cm²16 kgf/cm²
Thermal Conductivity3 N/A 0.9 W/m·K

Shelf Life from Date of Manufacture

 N/A 9 months

Dielectric Strength

 N/A 365 V/mil14.3 kV/mm

Dielectric Constant at 100 Hz

 N/A 4.44

Dielectric Constant at 100 kHz

 N/A 4.38

Dielectric Constant at 1 MHz

 N/A 4.9

Dissipation Factor at 100 Hz

 N/A 0.00498

Dissipation Factor at 100 kHz

 N/A 0.00498

Dissipation Factor at 1 MHz

 N/A 0.006

Volume Resistivity

 N/A 5.00E+15 O/cm

Features

N/A
High viscosity with moderate thermal conductivity; UL 94 V-l rating; fast tack-free

Potential Uses

N/A
Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners

Application Methods

N/A
Automated or manual dispensing

  • 1 Time to double initial mixed viscosity.
  • 2 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
  • 3 Thermal Conductivity at 25 ºC (77 ºF)