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One-part; gray
Unit of Measure

Specifications

Type

 N/A Thermally Conductive Adhesives

Product Form

 N/A One-Part

Color

 N/A Gray

Viscosity

 N/A 81000 mPa/s

Durometer

 N/A 87 A

Tensile Strength

 N/A 545 psi3.76 MPa38.3 kgf/cm²

Elongation

 N/A 15 %

Specific Gravity

 N/A 2.6

Linear CTE

 N/A 138 µ/mC
Heat Cure Time at 100 ºC (212 ºF)1 N/A 40 min
Heat Cure Time at 125 ºC (257 ºF)2 N/A 10 min
Heat Cure Time at 150 ºC (302 ºF)3 N/A 3 min

Unprimed Adhesion Lap Shear

 N/A 540 psi372 N/cm²37.9 kgf/cm²
Thermal Conductivity4 N/A 1.8 W/m·K

Shelf Life from Date of Manufacture

 N/A 6 months

Dielectric Strength

 N/A 400 V/mil15.7 kV/mm

Dielectric Constant at 100 Hz

 N/A 5.6

Dielectric Constant at 100 kHz

 N/A 5.5

Dissipation Factor at 100 Hz

 N/A 0.007

Dissipation Factor at 100 kHz

 N/A < 0.0001

Volume Resistivity

 N/A 7.10E+13 O/cm

Features

N/A
Rapid heat cure and primerless adhesion to common substrates used in the electronics industry

Potential Uses

N/A
Bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed

Application Methods

N/A
Manual or automated dispensing

  • 1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 4 Thermal Conductivity at 25 ºC (77 ºF)