These tack-free film adhesives are supplied die cut to the unique geometries of customer applications. Although th products have been employed in military applications for than two decades, we are pleased to introduce film advan to a wide range of industry applications. Consider films f innovative solution to common problems associated with traditional assembly techniques.
High electrical and thermal conductivity ideal for RF power applications. Void free bondline assures consistency in operation if device.
Specifications
Type |
N/A Electrically Conducting Adhesives |
Carrier |
N/A None |
Film Thickness |
N/A 2 mil4 mil |
Physical
Work Life at Room Temperature |
N/A 3 months |
Modulus |
N/A 530 kpsi |
Lap Shear Strength at 25 ºC, Al to Al |
N/A 3000 psi |
Thermal
Thermal Conductivity |
N/A 7 W/m·K |
Glass Transition Temperature |
N/A 90 ºC |
CTE Below Tg |
N/A 65 ppm/ºC |
CTE Above Tg |
N/A 150 ppm/ºC |
Applications
N/A
|