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2-part, 1:1 mix, black, general purpose encapsulant with good flowability and flame resistance, faster cure at room temperature
Unit of Measure

Specifications

Type

 N/A Silicone Encapsulants

Mix Ratio

 N/A 1:1

Color

 N/A Dark gray to black

Viscosity

 N/A 2850 mPa/s

Durometer

 N/A 45

Specific Gravity

 N/A 1.38

Working Time at Room Temperature

 N/A 4 min

Flammability Classification

 N/A 94 V-0

UL Temperature Index, Electrical/Mechanical

 N/A 170/170 ºC

Thermal Conductivity

 N/A 0.40 W/m·K9.6 x 10-4 cal/cm·s-ºC

Shelf Life from Date of Manufacture

 N/A 18 months

Dielectric Strength

 N/A 350 V/mil14 kV/mm

Dielectric Constant at 100 Hz

 N/A 3.53

Dielectric Constant at 100 kHz

 N/A 3.45

Dissipation Factor at 100 Hz

 N/A 0.0038

Dissipation Factor at 100 kHz

 N/A 0.0008

Volume Resistivity

 N/A 2.4 x 1015 O/cm

Features

N/A
1:1 mix ratio; low viscosity; low cost for silicone benefits; rapid room temperature or heat accelerated cure; moderate thermal conductivity; UL recognized

Potential Uses

N/A
General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays

Application Methods

N/A
Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight or volume; automated mixing and dispensing

Cure

N/A
10 minutes at 25 °C (77 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.