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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.
Unit of Measure

Specifications

Specific Gravity1 N/A 0.97 g/cc

Type

 N/A Standard Gels

Cure System

 N/A Addition cure

Color

 N/A Transparent blue

Viscosity [cPs or mPa·s]

 N/A 275

Penetration [1/10 of mm]

 N/A 60

Gel Hardness

 N/A 90 g
Shelf Life2 N/A 12 months

Working Time

 N/A < 10 min
Room Temperature Cure Time3 N/A 15 min/30 min

Heat Cure Time

 N/A 1.5 at 125 ºC

Dielectric Strength

 N/A 400 V/mil16 kV/mm

Dielectric Constant at 100 Hz/100 kHz

 N/A 2.75/2.75

Volume Resistivity

 N/A 3.60E+15 O/cm

Dissipation Factor at 100 Hz/100 kHz

 N/A 0.0004/< 0.00006

Linear Coefficient of Thermal Expansion

 N/A 435 µm/(m·ºC)

Product Form

N/A 3.60E+15

Features

N/A
0.0004/< 0.00006

  • 1 Cured or uncured A & B.
  • 2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
  • 3 Time to non-flow/full cure.