THERMATTACH® T418
Extremely High Strength Heat Sink & Component Attachment Tape
T418 is the latest offering in Chomerics’ line of industry-leading thermally conductive attachment tapes. Chomerics has utilized its world-class materials science expertise and decades of applications development experience to create this superior product, offering exceptional thermal and mechanical attachment properties.
THERMATTACH® T410 and T410-R ( T410-R is a RoHS compliant version of T410 with no visual or functional difference) tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.002 inch (0.05 mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T411 tape consists of a high bond strength pressure-sensitive adhesive with an expanded aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, continued providing a high adhesive strength attachment for heat sinks. The high per-formance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T413 ionically clean tapes feature a fiberglass carrier - T414 ionically clean tapes feature an electrically insulating film carrier. Both T413 and T414 double-sided adhesive tapes provide an effective thermal interface between components, ceramic hybrid circuits, printed circuit boards, flexible circuits, heat spreaders and heat sinks. Ionically clean, they provide good thermal conductivity and exceptional bonding properties - eliminating the need for thermal grease and mechanical fasteners. These tapes are embossed with a unique pattern for maximum conformability and minimal air pockets.
Extremely High Strength Heat Sink & Component Attachment Tape
T418 is the latest offering in Chomerics’ line of industry-leading thermally conductive attachment tapes. Chomerics has utilized its world-class materials science expertise and decades of applications development experience to create this superior product, offering exceptional thermal and mechanical attachment properties.
THERMATTACH® T410 and T410-R ( T410-R is a RoHS compliant version of T410 with no visual or functional difference) tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.002 inch (0.05 mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T411 tape consists of a high bond strength pressure-sensitive adhesive with an expanded aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, continued providing a high adhesive strength attachment for heat sinks. The high per-formance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T413 ionically clean tapes feature a fiberglass carrier - T414 ionically clean tapes feature an electrically insulating film carrier. Both T413 and T414 double-sided adhesive tapes provide an effective thermal interface between components, ceramic hybrid circuits, printed circuit boards, flexible circuits, heat spreaders and heat sinks. Ionically clean, they provide good thermal conductivity and exceptional bonding properties - eliminating the need for thermal grease and mechanical fasteners. These tapes are embossed with a unique pattern for maximum conformability and minimal air pockets.
Unit of Measure
Recommended for Plastic Component Attachment |
N/A No |
Color |
N/A White |
Embossed |
N/A Standard |
Test metod Carrier |
N/A Visual |
Reinforcement Carrier |
N/A Aluminum |
Test Method Thicknesses |
N/A ASTM D374 |
Thickness |
N/A 0.15 mm0.006 in |
Thickness Tolerance |
N/A ± 0.025 mm± 0.001 in |
Test Method Adhesive CTE |
N/A ASTM D3386 |
Adhesive CTE |
N/A 300 ppm/ºC |
Test Method Glass Transition Temperature |
N/A ASTM D1356 |
Glass Transition Temperature |
N/A –30 ºC–22 ºF |
Operating Temperature Range |
N/A –30 to 125 ºC–22 to 257 ºF |
Test Method Thermal Impedance |
N/A ASTM D5470 |
Thermal Impedance |
N/A 3.4 ºC-cm²/W0.5 ºC-in²/W |
Test Method Thermal Conductivity |
N/A ASTM D5470 |
Thermal Conductivity |
N/A 0.5 W/m·K |
Test Method Volume Resistivity |
N/A ASTM D257 |
Test Method Voltage Breakdown |
N/A ASTM D149 |
Test Method Lap Shear Strength |
N/A ASTM D1002 |
Lap Shear Strength at 25 ºC, Al to Al |
N/A 689 kPa100 psi |
Test Method 90º Peel Adhesion |
N/A ASTM D1000 |
90º Peel Adhesion to 0.002 in Aluminum Foil |
N/A 2.6 N/cm1.5 lbf/in |
Test Method Die Shear Adhesion |
N/A Chomerics #54 |
| Die Shear Adhesion after 400 psi Attachment 1 | N/A 862 kPa125 psi |
Test Method Creep Adhesion |
N/A PSTC-7 |
Creep Adhesion at 15 ºC (77 ºF) |
N/A > 50 days |
Creep Adhesion at 125 ºC (302 ºF) |
N/A > 10 days |
Test Method Flammability Rating |
N/A UL 94 |
Flammability Rating |
N/A V-0 |
Test Method RoHS Compliant |
N/A Chomeric Certification |
RoHS Compliant |
N/A Yes |
Test Method Shelf Life |
N/A Chomerics |
Shelf Life, Months from Date of Shipment |
N/A 12 |
- 1 2 h sample dwell time 25 ºC (77 ºF)
