Adhesive Product
Electronic Epoxy Adhesive/Sealants
Our adhesive product line includes a series of one and two part room and thermal cure epoxy adhesives as well as UV curable adhesives. These adhesives are used in a wide range of applications meeting the customers' most demanding requirements: high strength at elevated temperatures, low stress for mismatched thermal expansion applications and outstanding chemical resistance for harsh environments.
Unit of Measure
Items |
/Asset/a1138.jpg 104 A/B Adhesive Product |
/Asset/a1138.jpg 285/Catalyst 9 Adhesive Product |
/Asset/a1138.jpg 285/Catalyst 11 Adhesive Product |
/Asset/a1138.jpg 285/Catalyst 23LV Adhesive Product |
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Type | N/A High Temperature | N/A Thermally Conductive | N/A Thermally Conductive | N/A Thermally Conductive | ||||
Catalyst | N/A Part B | N/A 9 | N/A 11 | N/A 23LV | ||||
Viscosity at 25 ºC | N/A 25000 cps | N/A Paste | N/A Paste | N/A Paste | ||||
Mix Ratio (wt) | N/A 100:64 | N/A 100:3.5 | N/A 100:4.0 | N/A 100:7.3 | ||||
Cure Schedule | N/A Heat | N/A Room Temperature | N/A Heat | N/A Room Temperature | ||||
Working Life at 25 ºC | N/A > 12 h | N/A 45 min | N/A > 4 h | N/A 60 min | ||||
Specific Gravity | N/A 1.4 g/cc | N/A 2.27 g/cc | N/A 2.27 g/cc | N/A 2.18 g/cc | ||||
Hardness | N/A 90 D | N/A | N/A | N/A | ||||
Tensile Strength | N/A 12.4 psi | N/A 2100 psi | N/A 2100 psi | N/A 2100 psi | ||||
Thermal Conductivity | N/A 0.45 W/m·K | N/A 1.44 W/m·K | N/A 1.44 W/m·K | N/A 1.22 W/m·K | ||||
Glass Transition Temperature | N/A > 225 ºC | N/A 90 ºC | N/A 115 ºC | N/A 112 ºC | ||||
Service Temperature | N/A –25 to 230 ºC | N/A –40 to 130 ºC | N/A –55 to 155 ºC | N/A –65 to 105 ºC | ||||
Dielectric Strength | N/A 400 V/mil | N/A 450 V/mil | N/A 450 V/mil | N/A 450 V/mil | ||||
Volume Resistivity at 25 ºC | N/A 1 x 1015 O/cm | |||||||
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