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THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.

The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This
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Unit of Measure

Specifications

Test Method Color

Visual

Color

Purple/gray foil

Carrier

1 mil Metal Foil

Test Method Thicknesses

ASTM D374

Standard Thickness

0.088 mm0.0035 in

Test Method Specific Gravity

ASTM D792

Specific Gravity

2.6

Test Method Phase Transition Temperature

ASTM 3418

Phase Transition Temperature

55 ºC

Weight Loss, 125 ºC for 48 h

< 0.5 %

Test Method Thermal Impendance

ASTM D5470

Thermal Impendance at 70 ºC, at 69 kPa (10 psi)

0.97 ºC-cm²/W0.15 ºC-in²/W

Thermal Impendance at 70 ºC, at 172 kPa (25 psi)

0.58 ºC-cm²/W0.09 ºC-in²/W

Thermal Impendance at 70 ºC, at 345 kPa (50 psi)

0.39 ºC-cm²/W0.06 ºC-in²/W

Operating Temperature Range

–55 to 125 ºC–67 to 257 ºF

Test Method Volume Resistivity

ASTM D257

Volume Resistivity

1014 O/cm Metal Foil (electrically conductive)

Test Method Voltage Breakdown

ASTM D149

Test Method Flammability Rating

UL 94

Flammability Rating

Not tested

Test Method RoHS Compliant

Chomeric Certification

RoHS Compliant

Yes

Test Method Shelf Life

Chomerics

Shelf Life, Months from Date of Shipment

12