Robert McKeown Company, Inc.
Robert McKeown Company, Inc.
111 Chambers Brook Road
Branchburg NJ 08876
Toll Free: 1.800.631.1125
Phone: 908.218.9000
Fax: 908.218.8949
Email: sales@robertmckeown.com
Website: www.robertmckeown.com
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THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.

The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces, similar to thermal grease. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to outperform nonflowing elastomeric or graphite-based thermal pads and achieve performance comparable to thermal grease.

THERMFLOW materials are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly, THERMFLOW pads should not be used as electrical insulators.
Unit of Measure

Specifications

Test Method Color

 N/A Visual

Color

 N/A Gray

Carrier

 N/A None - Free film

Test Method Thicknesses

 N/A ASTM D374

Standard Thickness

 N/A 0.125 mm0.005 in

Test Method Specific Gravity

 N/A ASTM D792

Specific Gravity

 N/A 2.4

Test Method Phase Transition Temperature

 N/A ASTM 3418

Phase Transition Temperature

 N/A 45/62 ºC

Weight Loss, 125 ºC for 48 h

 N/A < 0.5 %

Test Method Thermal Impendance

 N/A ASTM D5470

Thermal Impendance at 70 ºC, at 69 kPa (10 psi)

 N/A 0.13 ºC-cm²/W0.02 ºC-in²/W

Thermal Impendance at 70 ºC, at 172 kPa (25 psi)

 N/A 0.097 ºC-cm²/W0.015 ºC-in²/W

Thermal Impendance at 70 ºC, at 345 kPa (50 psi)

 N/A 0.052 ºC-cm²/W0.008 ºC-in²/W

Operating Temperature Range

 N/A –55 to 125 ºC–67 to 257 ºF

Test Method Volume Resistivity

 N/A ASTM D257

Volume Resistivity

 N/A Nonconductive

Test Method Voltage Breakdown

 N/A ASTM D149

Test Method Flammability Rating

 N/A UL 94

Flammability Rating

 N/A Not tested

Test Method RoHS Compliant

 N/A Chomeric Certification

RoHS Compliant

 N/A Yes

Test Method Shelf Life

 N/A Chomerics

Shelf Life, Months from Date of Shipment

 N/A 12