Film Adhesives Product
Electrically Conductive Epoxy Adhesive/Sealants
Emerson & Cuming offers a wide range of electrically conductive and electrically insulating film adhesives. Film adhesives are used in a variety of applications; bonding h sinks to printed circuit boards, attaching lids, bonding components, sealing hermetic packages and providing E shielding.
These tack-free film adhesives are supplied die cut to the unique geometries of customer applications. Although th products have been employed in military applications for than two decades, we are pleased to introduce film adhesives to a wide range of industry applications. An innovative solution to common problems associated with traditional assembly techniques.
These tack-free film adhesives are supplied die cut to the unique geometries of customer applications. Although th products have been employed in military applications for than two decades, we are pleased to introduce film adhesives to a wide range of industry applications. An innovative solution to common problems associated with traditional assembly techniques.
Item # |
Type |
Carrier |
Film Thickness |
Recommended Cure Schedules |
Conductivity |
Glass Transition Temperature |
---|---|---|---|---|---|---|
CF3350 | Type N/A Electrically Conducting Adhesives | Carrier N/A None | Film Thickness N/A 2 mil4 mil | Recommended Cure Schedules N/A 10 min at 175 °C 2 h at 125 °C 30 min at 150 °C | Conductivity N/A 7 W/m·K | Glass Transition Temperature N/A 90 ºC |
5025E | Type N/A Electrically Conducting Adhesives | Carrier N/A None | Film Thickness N/A 2 mil3 mil4 mil5 mil6 mil | Recommended Cure Schedules N/A 2 h at 125 °C 30 min at 150 °C | Conductivity N/A 6.5 W/m·K | Glass Transition Temperature N/A 90 ºC |
5020K | Type N/A Electrically Insulating Adhesives | Carrier N/A Glass | Film Thickness N/A 4 mil5 mil6 mil | Recommended Cure Schedules N/A 1 h at 150 °C | Conductivity N/A 0.7 W/m·K | Glass Transition Temperature N/A 109 ºC |
561K | Type N/A Electrically Insulating Adhesives | Carrier N/A Glass | Film Thickness N/A 4 mil5 mil6 mil | Recommended Cure Schedules N/A 2 h at 125 °C 30 min at 150 °C | Conductivity N/A 0.8 W/m·K | Glass Transition Temperature N/A 55 ºC |