Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels,more
Unit of Measure

Specifications

Specific Gravity1 0.97/0.98 g/cc

Type

 Toughened Gels

Cure System

 Addition cure

Color

 Translucent green

Viscosity [cPs or mPa·s]

 400

Penetration [1/10 of mm]

 63 Shore 00 (Measured by durometer rather than penetration.)
Shelf Life2 12 months

Working Time

 > 60 min
Room Temperature Cure Time3 8 h/11 h

Heat Cure Time

 2 at 125 ºC (Time to adhesion may take longer.)

Dielectric Strength

 450 V/mil17 kV/mm

Dielectric Constant at 100 Hz/100 kHz

 2.6/2.61

Volume Resistivity

 3.30E+14 O/cm

Dissipation Factor at 100 Hz/100 kHz

 0.021/0.0002

Linear Coefficient of Thermal Expansion

 325 µm/(m·ºC)

Product Form

N/A
2-part, translucent green, 1:1 mix ratio, fast heat cure

Features

N/A
Fast heat cure; blue and yellow parts turn green when mixed; conditional primerless adhesion at room temperature; mechanical strength; UL 94 V-1 Flammability Rating; UV indicator for inspec tion; long working time

Under certain conditions in specific designs or applications, Dielectric Firm Gels may lose adhesion. Full environmental exposure testing is recommended.

  • 1 Cured or uncured A & B.
  • 2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
  • 3 Time to non-flow/full cure.