Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.

Low viscosity, high thermal conductivity, exce adhesion to gold
Unit of Measure

Max. Volume Resistivity

1 x 10-4 O/cm

Certified to MIL-STD-883, Method 5011

Yes

Viscosity

22000 cps

Work Life at Room Temperature

2 weeks

Cure

1 h at 150 ºC

Secondary Cure Option

2 h at 125 ºC

Lap Shear Strength

1885 psi

Die Shear Strength

6600 psi

Conductivity

3.6 W/m·K

Tg

103 ºC

CTE Below Tg

52 ppm/ºC

CTE Above Tg

200 ppm/ºC