THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.

The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces, similar to thermal grease. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to outperform nonflowing elastomeric or graphite-based thermal pads and achieve performance comparable to thermal grease.

THERMFLOW materials are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly, THERMFLOW pads should not be used as electrical insulators.
Unit of Measure
Items
Phase-Change

THERMFLOW Phase-Change Thermal Interface Pads

Phase-Change

THERMFLOW Phase-Change Thermal Interface Pads

Phase-Change

THERMFLOW Phase-Change Thermal Interface Pads

Phase-Change

THERMFLOW Phase-Change Thermal Interface Pads

Phase-Change

THERMFLOW Phase-Change Thermal Interface Pads
Test Method Color N/A Visual
Color N/A Pink N/A Light gray/off white N/A Pink N/A Purple/gray foil N/A Gray
Carrier N/A 1 mil Polyester N/A 2 mil Fiberglass N/A None - Free film N/A 1 mil Metal Foil N/A None - Free film
Test Method Thicknesses N/A ASTM D374
Standard Thickness N/A 0.178 mm0.007 in N/A 0.138 mm0.0055 in N/A 0.125 mm0.005 in N/A 0.088 mm0.0035 in N/A 0.125 mm0.005 in
Test Method Specific Gravity N/A ASTM D792
Specific Gravity N/A 1.1 N/A 1.15 N/A 1.1 N/A 2.6 N/A 2.4
Test Method Phase Transition Temperature N/A ASTM 3418
Phase Transition Temperature N/A 55 ºC N/A 45 ºC N/A 55 ºC N/A 55 ºC N/A 45/62 ºC
Weight Loss, 125 ºC for 48 h N/A < 0.5 %
Test Method Thermal Impendance N/A ASTM D5470
Thermal Impendance at 70 ºC, at 69 kPa (10 psi) N/A 2.26 ºC-cm²/W0.35 ºC-in²/W N/A 1.48 ºC-cm²/W0.23 ºC-in²/W N/A 0.71 ºC-cm²/W0.11 ºC-in²/W N/A 0.97 ºC-cm²/W0.15 ºC-in²/W N/A 0.13 ºC-cm²/W0.02 ºC-in²/W
Thermal Impendance at 70 ºC, at 172 kPa (25 psi) N/A 1.93 ºC-cm²/W0.30 ºC-in²/W N/A 1.03 ºC-cm²/W0.16 ºC-in²/W N/A 0.39 ºC-cm²/W0.06 ºC-in²/W N/A 0.58 ºC-cm²/W0.09 ºC-in²/W N/A 0.097 ºC-cm²/W0.015 ºC-in²/W
Thermal Impendance at 70 ºC, at 345 kPa (50 psi) N/A 1.18 ºC-cm²/W0.27 ºC-in²/W N/A 0.77 ºC-cm²/W0.12 ºC-in²/W N/A 0.26 ºC-cm²/W0.04 ºC-in²/W N/A 0.39 ºC-cm²/W0.06 ºC-in²/W N/A 0.052 ºC-cm²/W0.008 ºC-in²/W
Operating Temperature Range N/A –55 to 125 ºC–67 to 257 ºF
Test Method Volume Resistivity N/A ASTM D257
Volume Resistivity N/A 1014 O/cm N/A 1014 O/cm N/A 1014 O/cm N/A 1014 O/cm Metal Foil (electrically conductive) N/A Nonconductive
Test Method Voltage Breakdown N/A ASTM D149
Voltage Breakdown N/A 5000 Vac N/A N/A N/A N/A
Test Method Flammability Rating N/A UL 94
Flammability Rating N/A Not tested N/A Not tested N/A V-0 N/A Not tested N/A Not tested
Test Method RoHS Compliant N/A Chomeric Certification
RoHS Compliant N/A Yes
Test Method Shelf Life N/A Chomerics
Shelf Life, Months from Date of Shipment N/A 12