Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
Request Information Search by Specification
Unit of Measure
Items
Conductive Adhesive Product

Conductive Epoxy Adhesives
Conductive Adhesive Product

Conductive Epoxy Adhesives
Conductive Adhesive Product

Conductive Epoxy Adhesives
Conductive Adhesive Product

Conductive Epoxy Adhesives
Conductive Adhesive Product

Conductive Epoxy Adhesives
Filler N/A Ag N/A Ag N/A Ag N/A Ag N/A Ag/glass
Resin Type (Parts) N/A epoxy (2)
Specific Gravity N/A 2.5 g/cc N/A 2.7 g/cc N/A 2.3 g/cc N/A 2.6 g/cc N/A 1.9 g/cc
Max. Volume Resistivity N/A 0.002 O/cm N/A 0.005 O/cm N/A 0.001 O/cm N/A 0.050 O/cm N/A 0.020 O/cm
Lap Shear Min. N/A 1200 psi8274 kPa N/A 700 psi4826 kPa N/A 1400 psi9653 kPa N/A 1500 psi10342 kPa N/A 1000 psi6895 kPa
Elevated Temperature Cure Cycle Time N/A 0.25 h at 235 °F (113 ºC) N/A 0.75 h at 212 °F (100 ºC) N/A 30 min at 212 °F (100 ºC) & 24 h at RT N/A 0.5 h at 212 °F (100 ºC) N/A 30 min at 212 °F (100 ºC) & 24 h at RT
RT Cure Time N/A 24 h N/A 24 h N/A N/A 168 h N/A
Working Life N/A 30 min N/A 1 h N/A 45 min N/A 4 h N/A 45 min
Shelf Life at RT (Mos.) N/A 9 N/A 9 N/A 15 N/A 9 N/A 15
Recommended Primer N/A
Application N/A Bonding enclosures, connector shielding N/A Bonding enclosures N/A Bonding enclosures N/A Bonding enclosures N/A Bonding enclosures
Certified to MIL-STD-883, Method 5011 N/A
Viscosity N/A
Work Life at Room Temperature N/A
Cure N/A
Secondary Cure Option N/A
Lap Shear Strength N/A
Die Shear Strength N/A
Conductivity N/A
Tg N/A
CTE Below Tg N/A
CTE Above Tg N/A