CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper)

Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered.

CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive

CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications.
Unit of Measure
Items
CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes

CHO-FOIL Conductive Tapes
Tape Description N/A Copper foil, conductive adhesive version
Tape Width N/A 0.5 in12.7 mm N/A 1.0 in25.4 mm N/A 1.5 in38.1 mm N/A 2.0 in50.8 mm N/A 3.0 in76.2 mm
Part Number Prefix N/A CCH
Foil/Fabric Type N/A 1 oz. RA Copper
Foil/Fabric Thickness N/A 1.4 mil0.0356 mm
Adhesive Type N/A Electrically Conductive, Pressure-Sensitive Acrylic
Adhesive Thickness N/A 1.5 mil0.0381 mm
Total Thickness1 N/A 2.9 mil0.0737 mm
Temperature Range N/A –40 to 400 ºF–40 to 205 ºC
Test Method Flame Resistance N/A UL Subject 510
Flame Resistance N/A Pass
Test Method Adhesion to Aluminum N/A ASTM D1000
Adhesion to Aluminum N/A > 40 oz/in2.5 ppi438 N/m
Test Method Electrical Resistance N/A MIL-STD-202C
Electrical Resistance N/A < 0.003 O/in²< 0.0005 O/cm²
Test Method Initial Surface Resistivity N/A CHO-TP-57
Initial Surface Resistivity2 N/A < 2 mO
Test Method Initial Through Resistivity N/A CHO-TP-57
Initial Through Resistivity3 N/A < 3 mO
Test Method Initial Peel Strength N/A ASTM D1000
Initial Peel Strength4 N/A 44.8 oz/in2.8 ppi490 N/m
Test Method Initial Taber Abrasion Surface Resistivity N/A CHO-TP-57
Initial Taber Abrasion Surface Resistivity N/A < 6 mO
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity N/A CHO-TP-57
Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity N/A < 10 mO
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity N/A CHO-TP-57
Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity5 N/A <16 mO
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Peel N/A ASTM D1000
Heat Aging 185 ºF (85 ºC)/168 h, Peel N/A 57.6 oz/in3.6 ppi630 N/m
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity N/A CHO-TP-57
Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity N/A <10 mO
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity N/A CHO-TP-57
Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity N/A < 70 mO
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Peel N/A ASTM D1000
Heat Aging 250 ºF (121 ºC)/168 h, Peel N/A 57.6 oz/in3.6 ppi630 N/m
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity N/A CHO-TP-57
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity N/A
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity N/A CHO-TP-57
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity N/A
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel N/A ASTM D1000
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel N/A
Test Method Salt Fog Corrosion/168 h, Surface Resistivity N/A CHO-TP-57
Salt Fog Corrosion/168 h, Surface Resistivity N/A
Test Method Salt Fog Corrosion/168 h, Through Resistivity N/A CHO-TP-57
Salt Fog Corrosion/168 h, Through Resistivity N/A
Test Method Salt Fog Corrosion/168 h, Peel N/A ASTM D1000
Salt Fog Corrosion/168 h, Peel N/A
Test Method Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles N/A CHO-TP-57
Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles N/A < 3 mO
  • 1 Embossing adds 1.1 mil.
  • 2 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.
  • 3 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.

    For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.
  • 4 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate.
  • 5 For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.