Specialty Materials for Electronic Assembly
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Item # SE9184 CV Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants



One-part; non-flow; moisture cure




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type

Thermally Conductive Adhesives

Product Form

One-Part

Color

White

Viscosity

Non-flow

Durometer

72 A

Tensile Strength

421 psi
2.9
MPa
29.6
kgf/cm²

Elongation

70 %

Room Temperature Cure Time1

48 h

Unprimed Adhesion Lap Shear

300 psi
205
N/cm²
21
kgf/cm²

Thermal Conductivity2

0.84 W/m·K

Shelf Life from Date of Manufacture

7 months

Dielectric Strength

508 V/mil
20
kV/mm

Dielectric Constant at 1 MHz

3.9

Dissipation Factor at 1 MHz

0.002

Volume Resistivity

1.00E+15 O/cm
1 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
2 Thermal Conductivity at 25 ºC (77 ºF)


Features

Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free



Potential Uses

Bonding integrated circuit substrates; adhering lids and housings; heat sink attach



Application Methods

Automated or manual dispensing