One-part; non-flow; moisture cure
Unit of Measure

Specifications

Type

N/A Thermally Conductive Adhesives

Product Form

N/A One-Part

Color

N/A White

Viscosity

N/A Non-flow

Durometer

N/A 72 A

Tensile Strength

N/A 421 psi2.9 MPa29.6 kgf/cm²

Elongation

N/A 70 %
Room Temperature Cure Time1 N/A 48 h

Unprimed Adhesion Lap Shear

N/A 300 psi205 N/cm²21 kgf/cm²
Thermal Conductivity2 N/A 0.84 W/m·K

Shelf Life from Date of Manufacture

N/A 7 months

Dielectric Strength

N/A 508 V/mil20 kV/mm

Dielectric Constant at 1 MHz

N/A 3.9

Dissipation Factor at 1 MHz

N/A 0.002

Volume Resistivity

N/A 1.00E+15 O/cm

Features

N/A
Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free

Potential Uses

N/A
Bonding integrated circuit substrates; adhering lids and housings; heat sink attach

Application Methods

N/A
Automated or manual dispensing

  • 1 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
  • 2 Thermal Conductivity at 25 ºC (77 ºF)