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Item # SE4450 Adhesive
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Item # SE4450 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants
larger image
One-part; gray; heat cure
Specifications
·
Features
·
Potential Uses
·
Application Methods
Specifications
Type
Thermally Conductive Adhesives
Product Form
One-Part
Color
Gray
Viscosity
61000
mPa/s
Durometer
95 A
Tensile Strength
1044
psi
7.2
MPa
73.4
kgf/cm²
Elongation
40
%
Specific Gravity
2.74
Heat Cure Time at 150 ºC (302 ºF)
1
30
min
Unprimed Adhesion Lap Shear
530
psi
365
N/cm²
37
kgf/cm²
Thermal Conductivity
2
1.97
W/m·K
Shelf Life from Date of Manufacture
6 months
Dielectric Strength
610
V/mil
24
kV/mm
Dielectric Constant at 1 MHz
4.7
Dissipation Factor at 1 MHz
0.002
Volume Resistivity
2.00E+15
O/cm
1
Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
2
Thermal Conductivity at 25 ºC (77 ºF)
Features
High thermal conductivity
Potential Uses
Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks
Application Methods
Automated or manual dispensing