Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Silicone Adhesive/Sealants > Thermally Conductive Silicone Adhesive/Sealants > Dow Electronics Thermally Conductive Adhesives/Sealants > Item # SE4422 Adhesive  
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Item # SE4422 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

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One-part moisture cure




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Adhesives

Product Form
One-Part

Color
Gray

Viscosity
200000 mPa/s

Durometer
69 A

Tensile Strength
754 psi
5.2 MPa
53 kgf/cm²

Elongation
120 %

Specific Gravity
2.17

Linear CTE
203 µ/mC

Working Time at Room Temperature1
< 10 min

Room Temperature Cure Time2
144 h

Unprimed Adhesion Lap Shear
230 psi
160 N/cm²
16 kgf/cm²

Thermal Conductivity3
0.9 W/m·K

Shelf Life from Date of Manufacture
9 months

Dielectric Strength
365 V/mil
14.3 kV/mm

Dielectric Constant at 100 Hz
4.44

Dielectric Constant at 100 kHz
4.38

Dielectric Constant at 1 MHz
4.9

Dissipation Factor at 100 Hz
0.00498

Dissipation Factor at 100 kHz
0.00498

Dissipation Factor at 1 MHz
0.006

Volume Resistivity
5.00E+15 O/cm
1 Time to double initial mixed viscosity.
2 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
3 Thermal Conductivity at 25 ºC (77 ºF)


Features

High viscosity with moderate thermal conductivity; UL 94 V-l rating; fast tack-free


Potential Uses

Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners


Application Methods

Automated or manual dispensing