Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Adhesives & Sealants > Silicone Adhesive/Sealants > Thermally Conductive Silicone Adhesive/Sealants > Dow Electronics Thermally Conductive Adhesives/Sealants > Item # 340 Heat Sink Compound  
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Item # 340 Heat Sink Compound, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

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Non-curing, thermally conductive silicone paste




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Compounds

Product Form
One-Part

Color
White

Viscosity
Nonflowing

Specific Gravity
2.1

Thermal Conductivity1
0.59 W/m·K

Shelf Life from Date of Manufacture
60 months

Dielectric Strength
210 V/mil
8.3 kV/mm

Dielectric Constant at 100 Hz
5

Dielectric Constant at 100 kHz
5

Dissipation Factor at 100 Hz
0.001

Dissipation Factor at 100 kHz
0.02

Volume Resistivity
2.00E+15 O/cm
1 Thermal Conductivity at 25 ºC (77 ºF)


Features

Low bleed; stable at high temperatures


Potential Uses

Thermal coupling of electrical/electronic devices to heat sinks


Application Methods

Automated or manual dispensing