Specialty Materials for Electronic Assembly
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Item # 3-6753 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

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Two-part; gray; heat cure




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Adhesives

Product Form
Two-Part

Color
Gray

Viscosity
11000 mPa/s

Durometer
72 A

Tensile Strength
400 psi
2.76 MPa
28.1 kgf/cm²

Elongation
35 %

Specific Gravity
2.3

Compression Modulus at 10 %
125 psi

Linear CTE
179 µ/mC

Working Time at Room Temperature1
2 h

Room Temperature Cure Time2
Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion.

Heat Cure Time at 100 ºC (212 ºF)3
50 min

Heat Cure Time at 125 ºC (257 ºF)4
40 min

Heat Cure Time at 150 ºC (302 ºF)5
10 min

Unprimed Adhesion Lap Shear
540 psi
372 N/cm²
37.9 kgf/cm²

Thermal Conductivity6
1.4 W/m·K

Shelf Life from Date of Manufacture
12 months

Dielectric Strength
454 V/mil
17.9 kV/mm

Dielectric Constant at 100 Hz
4.7

Dielectric Constant at 100 kHz
4.7

Dissipation Factor at 100 Hz
0.0045

Dissipation Factor at 100 kHz
0.00013

Volume Resistivity
7.2E+13 O/cm
1 Time to double initial mixed viscosity.
2 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
4 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
5 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
6 Thermal Conductivity at 25 ºC (77 ºF)


Features

Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control


Potential Uses

Bonding heat sinks to electronic devices; bonding printed circuit boards to substrates


Application Methods

Manual or automated meter-mix and dispensing