Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Silicone Adhesive/Sealants > Thermally Conductive Silicone Adhesive/Sealants > Dow Electronics Thermally Conductive Adhesives/Sealants > Item # 3-6752 Adhesive  
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Item # 3-6752 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

larger image
One-part; gray




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Adhesives

Product Form
One-Part

Color
Gray

Viscosity
81000 mPa/s

Durometer
87 A

Tensile Strength
545 psi
3.76 MPa
38.3 kgf/cm²

Elongation
15 %

Specific Gravity
2.6

Linear CTE
138 µ/mC

Heat Cure Time at 100 ºC (212 ºF)1
40 min

Heat Cure Time at 125 ºC (257 ºF)2
10 min

Heat Cure Time at 150 ºC (302 ºF)3
3 min

Unprimed Adhesion Lap Shear
540 psi
372 N/cm²
37.9 kgf/cm²

Thermal Conductivity4
1.8 W/m·K

Shelf Life from Date of Manufacture
6 months

Dielectric Strength
400 V/mil
15.7 kV/mm

Dielectric Constant at 100 Hz
5.6

Dielectric Constant at 100 kHz
5.5

Dissipation Factor at 100 Hz
0.007

Dissipation Factor at 100 kHz
< 0.0001

Volume Resistivity
7.10E+13 O/cm
1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
4 Thermal Conductivity at 25 ºC (77 ºF)


Features

Rapid heat cure and primerless adhesion to common substrates used in the electronics industry


Potential Uses

Bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed


Application Methods

Manual or automated dispensing