Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Silicone Adhesive/Sealants > Thermally Conductive Silicone Adhesive/Sealants > Dow Electronics Thermally Conductive Adhesives/Sealants > Item # 1-4174 Adhesive  
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Item # 1-4174 Adhesive, Dow Electronics Thermally Conductive Adhesives/Sealants


EMI Shielding Electrical Tape

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One-part; low flow; gray




Specifications  · Features  · Potential Uses  · Application Methods

Specifications

Type
Thermally Conductive Adhesives

Product Form
One-Part

Color
Gray

Viscosity
58000 mPa/s

Durometer
92 A

Tensile Strength
900 psi
6.2 MPa
63.3 kgf/cm²

Specific Gravity
2.71

Heat Cure Time at 100 ºC (212 ºF)1
90 min

Heat Cure Time at 125 ºC (257 ºF)2
30 min

Heat Cure Time at 150 ºC (302 ºF)3
20 min

Unprimed Adhesion Lap Shear
590 psi
405 N/cm²
41 kgf/cm²

Thermal Conductivity4
1.9 W/m·K

Shelf Life from Date of Manufacture
6 months at 5 ºC

Dielectric Strength
425 V/mil
16.7 kV/mm

Dielectric Constant at 100 kHz
4.63

Dissipation Factor at 100 kHz
0.0021

Volume Resistivity
1.90E+14 O/cm
1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
4 Thermal Conductivity at 25 ºC (77 ºF)


Features

Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control


Potential Uses

Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach


Application Methods

Automated or manual dispensing