One-part; low flow; gray
Unit of Measure

Specifications

Type

N/A Thermally Conductive Adhesives

Product Form

N/A One-Part

Color

N/A Gray

Viscosity

N/A 58000 mPa/s

Durometer

N/A 92 A

Tensile Strength

N/A 900 psi6.2 MPa63.3 kgf/cm²

Specific Gravity

N/A 2.71
Heat Cure Time at 100 ºC (212 ºF)1 N/A 90 min
Heat Cure Time at 125 ºC (257 ºF)2 N/A 30 min
Heat Cure Time at 150 ºC (302 ºF)3 N/A 20 min

Unprimed Adhesion Lap Shear

N/A 590 psi405 N/cm²41 kgf/cm²
Thermal Conductivity4 N/A 1.9 W/m·K

Shelf Life from Date of Manufacture

N/A 6 months at 5 ºC

Dielectric Strength

N/A 425 V/mil16.7 kV/mm

Dielectric Constant at 100 kHz

N/A 4.63

Dissipation Factor at 100 kHz

N/A 0.0021

Volume Resistivity

N/A 1.90E+14 O/cm

Features

N/A
Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control

Potential Uses

N/A
Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach

Application Methods

N/A
Automated or manual dispensing

  • 1 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 2 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 4 Thermal Conductivity at 25 ºC (77 ºF)