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Specialty Materials for Electronic Assembly
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Item # Sylgard® 577 Primerless Silicone Adhesive Kit
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Item # Sylgard® 577 Primerless Silicone Adhesive Kit, Electronics Adhesive Sealants
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Gray; 2-part (10:1 mix ratio) – heat cure; medium viscosity providing flow/fill/self-leveling after dispensing process; long working time – reducing need for equipment purge/clean-up; cure can be accelerated with elevated temperatures for faster processing; two-part system enables deep section and confined cures; MIL-PRF-23586F QPL (qualified product listing); high tensile strength; UL 94V-0 flammability rating; room temperature storage
Specifications
·
Features
·
Potential or Typical Uses
Specifications
Type
Two-Part Heat Cure
One or Two Part
2
Color
Gray
Viscosity/Flowability
112500
Durometer
63 A
Tensile Strength
940
psi
6.5
MPa
65
kgf/cm²
Elongation
200
%
Specific Gravity
1.29
Working Time at Room Temperature
22 h
Heat Cure Time
60 min at 125 ºC
Unprimed Adhesion Lap Shear
960
psi
650
N/cm²
66
kgf/cm²
Linear Coefficient of Thermal Expansion
300
ppm
Shelf Life from Date of Manufacture
12 months at < 32 ºC
Dielectric Strength
500
V/mil
20
kV/mm
Dielectric Constant at 100 Hz
2.83
Dielectric Constant at 100 kHz
2.78
Dissipation Factor at 100 Hz
0.006
Dissipation Factor at 100 kHz
0.0004
Volume Resistivity
1.3E+15
O/cm
Agency Listing
UL 94V-0/ MIL-PRF-23586F
Features
Flowable; 10:1 mix ratio; heat cure; high tensile strength; long working time after mixing; no added solvents
Potential or Typical Uses
Sealing lids and housings; attaching baseplates; gasketing; connector sealing