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Specialty Materials for Electronic Assembly
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Film-PTFE Extruded Backing Substrates
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Part Number 2283-2
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Part Number 2283-2, Film-PTFE Extruded Backing Substrates
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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Specifications
Color
Rust
Adhesive System
A
Backing Thickness
2.0
mil
0.051
mm
Adhesive Thickness
2.0
mil
0.051
mm
Total Thickness
4.0
mil
0.102
mm
Adhesion Strength
30
oz/in
331
g/cm
Tensile Strength
30
lb/in
5.0
kg/cm
Elongation
150
%
Dielectric
10.0
kV
Min Temperature Range
-40
ºF
-40
ºC
Max Temperature Range
350
ºF
177
ºC