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Specialty Materials for Electronic Assembly
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Film-PTFE Extruded Backing Substrates
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Part Number 2275-2
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Part Number 2275-2, Film-PTFE Extruded Backing Substrates
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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Specifications
Color
Rust
Adhesive System
S
Backing Thickness
2.3
mil
0.058
mm
Adhesive Thickness
1.9
mil
0.048
mm
Total Thickness
4.2
mil
0.107
mm
Adhesion Strength
40
oz/in
441
g/cm
Tensile Strength
45
lb/in
8.0
kg/cm
Elongation
110
%
Dielectric
11.0
kV
Min Temperature Range
-100
ºF
-73
ºC
Max Temperature Range
500
ºF
260
ºC