Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulants > Item # Sylgard® Q3-3600 A&B Thermally Conductive Encapsulant  
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Item # Sylgard® Q3-3600 A&B Thermally Conductive Encapsulant, Silicone Potting/Encapsulants


Silicone-Potting-Encapsulants

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2 part, 1:1 mix, rapid heat cure, self-priming adhesion and good flame resistance




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Silicone Encapsulants

Mix Ratio
1:1

Color
Gray

Viscosity
4700 mPa/s

Durometer
73

Specific Gravity
2.13

Working Time at Room Temperature
> 24 h

Thermal Conductivity
0.8 W/m·K
0.0018 cal/cm·s-ºC

Shelf Life from Date of Manufacture
6 months

Dielectric Strength
650 V/mil
26 kV/mm

Volume Resistivity
1.0 x 1015 O/cm


Features

1:1 mix ratio; long pot life; excellent flow; self- priming; thermally conductive; UL V-l flammability rating


Potential Uses

General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, solar cells


Application Methods

Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed 1:1 ratio by weight; automated mixing and dispense; manual mixing


Cure

1 hour at 100 ºC (212 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.