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2-part, 10:1 mix, translucent encapsulant with high tear strength
Unit of Measure

Specifications

Type

 N/A Silicone Encapsulants

Mix Ratio

 N/A 10:1

Color

 N/A Translucent

Viscosity

 N/A 66700 mPa/s

Durometer

 N/A 24

Specific Gravity

 N/A 1.12

Working Time at Room Temperature

 N/A 4 h

Flammability Classification

 N/A 94 HB

UL Temperature Index, Electrical/Mechanical

 N/A 140/140 ºC

Thermal Conductivity

 N/A 0.21 W/m·K4.8 x 10-4 cal/cm·s-ºC

Linear Coefficient of Thermal Expansion

 N/A 330 ppm

Shelf Life from Date of Manufacture

 N/A 12 months

Dielectric Strength

 N/A 450 V/mil18 kV/mm

Dielectric Constant at 100 Hz

 N/A 2.70

Dielectric Constant at 100 kHz

 N/A 2.68

Dissipation Factor at 100 Hz

 N/A 0.00002

Dissipation Factor at 100 kHz

 N/A 0.00006

Volume Resistivity

 N/A 5.0 x 1015 O/cm

Features

N/A
10:1 mix ratio; high viscosity; room temperature or heat cure; high tear strength; UL recognized

Potential Uses

N/A
General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays; adhe- sive/encapsulant for solar cells; adhesive handling beam lead integrated circuits during processing

Application Methods

N/A
Supplied as two-part liquid component kits comprised of Base/Curing Agent to be mixed in a 10:1 ratio by weight or volume; automated mixing and dispensing; manual mixing

Cure

N/A
48 hours at room temperature
25 minutes at 100 °C (212 °F)
15 minutes at 150 °C (302 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.