Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulants > Item # Sylgard® 160 Silicone Elastomer  
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Item # Sylgard® 160 Silicone Elastomer, Silicone Potting/Encapsulants



2-part, 1:1 mix, dark gray, general purpose encapsulant with good flowability and flame resistance




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type

Silicone Encapsulants

Mix Ratio

1:1

Color

Gray

Viscosity

6400 mPa/s

Durometer

56

Specific Gravity

1.57

Working Time at Room Temperature

25 min

Flammability Classification

94 V-0

UL Temperature Index, Electrical/Mechanical

105/105 ºC

Thermal Conductivity

0.62 W/m·K
1.5 x 10-3
cal/cm·s-ºC

Linear Coefficient of Thermal Expansion

200 ppm

Shelf Life from Date of Manufacture

18 months

Dielectric Strength

475 V/mil
19
kV/mm

Dielectric Constant at 100 Hz

3.51

Dielectric Constant at 100 kHz

3.45

Dissipation Factor at 100 Hz

0.0047

Dissipation Factor at 100 kHz

0.0012

Volume Resistivity

5.6 x 1014 O/cm


Features

1:1 mix ratio; good flowability; low cost for silicone benefits; room temperature or heat accelerated cure; moderate thermal conductivity; UL recognized



Potential Uses

General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays



Application Methods

Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight or volume; automated mixing and dispensing; manual mixing



Cure

24 hours at 25 °C (77 °F)
4 minutes at 100 °C (212 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.