Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulants > Item # 3-4207 Dielectric Tough Gel Kit  
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Item # 3-4207 Dielectric Tough Gel Kit, Silicone Potting/Encapsulants


Silicone-Potting-Encapsulants

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2-part, translucent green, 1:1 mix ratio, fast room temperature cure. Tough gel with UV indicator, conditional primerless adhesion and good flame resistance




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Primerless Silicone Encapsulants

Mix Ratio
1:1

Color
Green
Translucent

Viscosity
425 mPa/s

Durometer
30

Specific Gravity
0.97

Working Time at Room Temperature
10 min

Flammability Classification
94 V-1

Thermal Conductivity
0.15 W/m·K
3.6 x 10-4 cal/cm·s-ºC

Linear Coefficient of Thermal Expansion
325 ppm

Shelf Life from Date of Manufacture
6 months

Dielectric Strength
425 V/mil
17 kV/mm

Dielectric Constant at 100 Hz
2.85

Dielectric Constant at 100 kHz
2.86

Dissipation Factor at 100 Hz
0.03

Dissipation Factor at 100 kHz
< 0.0001

Volume Resistivity
7.1 x 1013 O/cm


Features

Fast room temperature cure; two parts are blue and yel low and turn green when mixed; conditional primerless adhesion at room temperature; mechanical strength; UL 94 V-1 flammability rating; UV indicator for inspection. Under certain conditions in specific designs or applications, Dow 3-4207 Dielectric Tough Gel may lose adhesion; full environmental exposure testing is recommended.


Potential Uses

Encapsulating applications for various electronic devices, especially those requiring stronger adhesion or improved dimensional stability


Application Methods

Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight or volume; automated or manual mixing and dispensing can be used


Cure

1.5 hours at room temperature
10 minutes at 50 °C (122 °F)
3 minutes at 100 °C (212 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.