Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # W 19/Catalyst 9  
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Item # W 19/Catalyst 9, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Very low viscosity, unfilled, 100% solids




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
9


Handling

Viscosity at 25 ºC
200 cps

Mix Ratio (wt)
100:15

Cure Schedule
Room


Physical

Specific Gravity
1.09 g/cc

Hardness
78 D


Thermal

Service Temperature
–40 to 130 ºC


Electrical

Dielectric Strength
400 V/mil

Volume Resistivity at 25 ºC
1 x 1012 O/cm