Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # W 19/Catalyst 11  
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Item # W 19/Catalyst 11, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Very low viscosity, unfilled, 100% solids




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
11


Handling

Viscosity at 25 ºC
200 cps

Mix Ratio (wt)
100:17

Cure Schedule
Heat


Physical

Specific Gravity
1.11 g/cc

Hardness
78 D


Thermal

Service Temperature
–55 to 155 ºC


Electrical

Dielectric Strength
400 V/mil

Dielectric Constant at 1 MHz
3.3

Volume Resistivity at 25 ºC
1 x 1012 O/cm