Specialty Materials for Electronic Assembly
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Item # EFF-15, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Free flowing syntactic foam powder




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
General Purpose


Handling

Viscosity at 25 ºC
Powder

Cure Schedule
Heat


Physical

Specific Gravity
0.24 g/cc


Thermal

CTE
21 ppm/ºC

Thermal Conductivity
0.12 W/m·K

Service Temperature
–65 to 175 ºC


Electrical

Dielectric Strength
200 V/mil

Dielectric Constant at 1 MHz
1.38