Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # E 151-8  
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Item # E 151-8, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Low viscosity, excellent thermal shock




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity


Handling

Viscosity at 25 ºC
1100 cps

Cure Schedule
Heat


Physical

Specific Gravity
1.05 g/cc

Hardness
55 D


Thermal

CTE
60 ppm/ºC

Service Temperature
–40 to 130 ºC


Electrical

Dielectric Strength
325 V/mil

Dielectric Constant at 1 MHz
3.4

Volume Resistivity at 25 ºC
9 x 1014 O/cm