Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 4954  
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Item # 4954, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Silicone, high temperature




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive

Catalyst
50


Handling

Viscosity at 25 ºC
40000 cps

Mix Ratio (wt)
100:0.1–0.4

Cure Schedule
Room


Physical

Specific Gravity
2.30 g/cc

Hardness
80 A

Tensile Strength
525 psi


Thermal

CTE
157 ppm/ºC

Thermal Conductivity
1.3 W/m·K

Service Temperature
–65 to 260 ºC


Electrical

Dielectric Strength
520 V/mil

Dielectric Constant at 1 MHz
5.03

Volume Resistivity at 25 ºC
1 x 1014 O/cm